Field Process Engineer

40 hrs/week, Mon-Fri, 8:30 a.m. - 5:30 p.m. MINIMUM REQUIREMENTS: Must have a Bachelor's degree or foreign equivalent in Materials Science & Engineering, Electrical Engineering, Computer Engineering, Chemistry, Physics or a related field, plus 4 years of experience in process or productivity engineering. Alternatively, will accept Master's degree or foreign equivalent in Materials Science & Engineering, Electrical Engineering, Computer Engineering, Chemistry, Physics or a related field plus 2 years of experience in process or productivity engineering. Of the required experience, must have 1 year of experience in 5 or more of the following (which may be gained concurrently): Design of Experiment (DOE); Statistical Process Control (SPC); Multivariate data sets; Semiconductor fabrication; Plasma physics, plasma chemistry, or plasma reactors; Excel; JMP ( Statistical Software ); Power BI; POWER POINT PRESENTATIONS; Electric Power Systems; Mechanical Engineering; Must have 1 year of experience in 3 or more of the following (which may be gained concurrently): Wafer cross section techniques; Wafer fabrication processes; Ion transport phenomena; Dynamic random-access memory (DRAM); Plasma Etching; Plasma simulation; Semiconductor thin film deposition; Atomic Layer Deposition (ALD); 3D NAND Flash; Chemical Vapor Deposition (CVD); Plasma Enhanced Chemical Vapor Deposition (PECVD). Of the required experience must have 1 year of experience in 1 or more of the following (which may be gained concurrently): MATLAB; LabVIEW; JMP; Hybrid Plasma Equipment Model (HPEM); Mathematica; Origin. Any suitable combination of education, training, and experience is acceptable. Requires up to 10% international & domestic travel. Please email resume to and reference Job # 4162 .