Module Development Engineer

Job Description

• Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications
• Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements
• Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmap
• Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products
• Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology
• Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods
• Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications:

• PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ months of relevant experience

OR

• Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 3+ years of relevant experience

OR

• Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of relevant experience

Relevant recent experience includes, but is not limited to:

• Hands-on experience in dry etch semiconductor processing within a manufacturing or manufacturing adjacent Research and Development environment
• Strong understanding of plasma etch fundamentals, including plasma–surface interactions, selectivity, profile control, and defect mechanisms
• Demonstrated experience with process development, optimization, and characterization for advanced semiconductor technologies
• Proficiency in statistical data analysis and design of experiments (DOE) using tools such as JMP, Python, or MATLAB
• Experience operating, qualifying, and troubleshooting semiconductor manufacturing equipment in a cleanroom environment
• Ability to analyze complex process data, identify root causes, and implement data driven corrective actions

Preferred Qualifications:

• 3+ years of direct experience developing and ramping dry etch processes for advanced technology nodes in a high volume manufacturing or foundry environment
• Experience with one or more of the following dry etch technologies:
  • ICP / CCP plasma etch
  • High aspect ratio etch (HARC)
  • Atomic layer etch (ALE)
  • EUV patterned layer etch integration
• Demonstrated contributions to yield improvement, defect reduction, profile control, or process window expansion at the module or integration level
• Working knowledge of advanced device architectures (e.g., FinFET, GAA, nanosheets) and their etch specific challenges
• Experience with physical and materials characterization techniques, such as SEM, TEM, CD SEM, AFM, XPS, or ellipsometry
• Familiarity with image analysis and automated data processing techniques for metrology and defect inspection
• Proven ability to work effectively with cross functional teams (integration, lithography, CMP, device, yield, equipment suppliers) to deliver robust manufacturing solutions
• Demonstrated technical leadership within projects, including mentoring junior engineers or influencing technical direction without formal authority.

For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.



Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00
*Salary range dependent on a number of factors including location and experience

Working Model

This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

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