Company:
INTEL
Location: Phoenix
Closing Date: 27/06/2026
Salary: £0.00 - £0.00 y
Hours: Full Time
Type: Permanent
Job Description
Advanced Packaging Technology and Manufacturing (APTM) Yield Organization is looking for a Yield Analyst who will drive yield improvement activities across APTM packaging technologies.
Define yield roadmap and drive yield improvement activities through yield working group/taskforce using your formal education, model-based problem solving, knowledge of manufacturing process and data analytics in collaboration with Process modules, Integration and other key stakeholders.
• Extract key insights through data analytics from various data sources such as inline tool data, images from metrology tools, electrical test, lab characterization etc.
• Monitor factory yield issues and respond promptly to daily yield loss events. Possess a Bachelor with +3 years of experience or Master with 2+ years of experience or Ph.D degree in Physics or Mechanical Engineering or Material Science or Electrical Engineering or Chemistry or any other relevant STEM field.
• 2+ years of experience in data analytics using Python and/or JMP. Familiarity of Python libraires for data science work (NumPy, Pandas, Scipy, Matplotlib, Scikit-learn, TensorFlow, PyTorch etc.)
Prior experience working in wafer level and/or package assembly, and familiarity of process flow, tools, yield issues. • Able to connect analysis results to process fundamental, process tool behaviors and fundamental physics. Self-driven with minimum supervision, good communication skills, tolerance of ambiguity, be effective in a fast-paced work environment and strong sense of ownership. • All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. This role will require an on-site presence. * By applying, you consent to share your data with SonicJobs and the employer. College Recruiter or SonicJobs does not store or use your application data beyond facilitating the application. See Intel Privacy Policy at and SonicJobs Privacy Policy at us/privacy-policy and Terms of Use at us/terms-conditions
Prior experience working in wafer level and/or package assembly, and familiarity of process flow, tools, yield issues. • Able to connect analysis results to process fundamental, process tool behaviors and fundamental physics. Self-driven with minimum supervision, good communication skills, tolerance of ambiguity, be effective in a fast-paced work environment and strong sense of ownership. • All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. This role will require an on-site presence. * By applying, you consent to share your data with SonicJobs and the employer. College Recruiter or SonicJobs does not store or use your application data beyond facilitating the application. See Intel Privacy Policy at and SonicJobs Privacy Policy at us/privacy-policy and Terms of Use at us/terms-conditions
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